Passive Coldplates
Memory Cooling MX5
End-to-end flow allows for board-level VR cooling Construction Brazed Flattened copper tube Copper block Standard performance gap pads Stamped SS tube construction allows for greater geometric flexibility. Designed to support up to 30 installation cycles, technicians no longer need to worry about removing the cooling solution to replace each DIMM.
Memory Cooling MX4
End-to-end flow allows for board-level VR cooling Construction Brazed Flattened copper tube Copper block Standard performance gap pads Designed to support up to 30 installation cycles, technicians no longer need to worry about removing the cooling solution to replace each DIMM.
GP4
Engineered specifically for AMD MI200 accerlerators, CoolIT Systems’ GP4 Passive Coldplate enables the highest wattage processors. Leveraging CoolIT’s patented Split-Flow design theory, GP4 eliminates the need for remote heatsinks and maximizes density in even the most compact 1U applications.
RD1
Engineered specifically for AMD® EPYC® CPU, CoolIT Systems’ Rack DLC™ RD1 Passive Coldplate enables the highest wattage CPUs. Leveraging CoolIT’s patented Split-Flow design theory, RD1 eliminates the need for remote heatsinks and maximizes density in even the most compact 1U applications.
RX4
Engineered specifically for Intel® Xeon® Scalable Processor Family (Cascade Lake AP), CoolIT Systems’ Rack DLC™ RX4 Passive Coldplate enables the highest wattage CPUs. Leveraging CoolIT’s patented Split-Flow design theory, RX4 eliminates the need for remote heatsinks and maximizes density in even the most compact 1U applications.
RX3
Engineered specifically for Intel® Xeon® Scalable Processor Family (Icelake), CoolIT Systems’ Rack DLC™ RX3 Passive Coldplate enables the highest wattage CPUs. Leveraging CoolIT’s patented Split-Flow design theory, RX3 eliminates the need for remote heatsinks and maximizes density in even the most compact 1U applications.
RX1
Engineered specifically for Intel® Xeon® Scalable Processor Family (Skylake), CoolIT Systems’ Rack DLC™ RX1 Passive Coldplate enables the highest wattage CPUs. Leveraging CoolIT’s patented Split-Flow design theory, RX1 eliminates the need for remote heatsinks and maximizes density in even the most compact 1U applications.
