Join CoolIT Systems at the OCP Global Summit 2024, the premier event uniting forward-thinking minds in open IT ecosystem development.
Visit us at Booth #A34 to discover our cutting-edge liquid cooling solutions, including the newly launched AHx180 liquid-to-air CDU, designed to meet the cooling demands of the NVIDIA GB200 NVL72. We will also showcase our industry-leading OMNI™ All-Metal Coldplates with Split-Flow™ technology, designed for precision cooling for thermal loads over 1,500W TDP and fluxes exceeding 300 W/cm². CoolIT is proud to sponsor this summit, fostering collaboration and innovation in open hardware and software.
Meet our Team:
Speaker: Brad Zakaib
Date: Thursday, October 17, 8:55am – 9:15am
Location: SJCC – Concourse Level – 210AE
Topic: CDU Test Requirements and Methodology
Liquid cooling technology is becoming more ubiquitous due to increasing power and densities of processors and other IT components. Air-cooling solutions cannot always address the thermal challenges of high-performance computing systems with high thermal design power processors. The Coolant Distribution Unit (CDU) is a key ingredient of liquid cooling flow network, which circulates coolant fluid between the heat exchanger and IT equipment. CDU design, manufacturing and qualification requires special consideration on material selection and evaluation to comply with the application requirements. All wetted materials must be compatible with the fluid to prevent corrosion and contamination. The CDU has telemetry and control devices to monitor and maintain coolant circulation at the required pressure, temperature, and flow rate. This presentation provides CDU test requirements and methodologies addressing cooling performance rating, quality control, and recommendations on basic qualification methods.
Register now: https://2024ocpglobal.fnvirtual.app/registration/
Speaker: Reza Najjari
Date: Wednesday, October 16, 8:55am – 9:15am
Location: SJCC – Concourse Level – Expo Hall Stage
Topic: The Trade-offs Between Single-phase and Two-phase DLC
With the growth of AI, liquid cooling of IT equipment is no longer optional. Power consumption and heat dissipation have dramatically increased. Liquid cooling is now required to manage heat loads of AI semiconductors with historically high heat fluxes and AI servers with increasing rack densities.
There are two core approaches to liquid cooling: single-phase using water or a water-glycol mixture as a coolant and two-phase using refrigerants. In single-phase cooling, the coolant remains in the liquid state, whereas in two-phase cooling, the refrigerant changes between liquid and gas phases.
In this forum, we will provide a technical assessment of single-phase and two-phase direct-to-chip liquid cooling (DLC) technologies, focusing on system design and operational differences. These differences help explain why single-phase DLC, today, is a mature technology seeing mainstream adoption. In contrast, two-phase DLC is earlier in the technology adoption cycle and still faces technical and operational hurdles.
Register now: https://2024ocpglobal.fnvirtual.app/registration/
About CoolIT Systems
CoolIT Systems specializes in scalable liquid cooling solutions for the world’s most demanding computing environments. A 23-year pioneer in microprocessor liquid cooling systems, CoolIT’s technology cools over 5 million GPUs and CPUs globally. In the AI, high-performance computing and enterprise data center markets, CoolIT partners with global processor and server design leaders to develop the most efficient and reliable liquid cooling solutions for their leading-edge products. Through its modular direct liquid cooling (DLC) technology, CoolIT enables dramatic increases in rack densities, component performance and power efficiencies. Together, CoolIT and its partners are leading the way for the widespread adoption of accelerated and advanced computing.
For more information about CoolIT Systems and its technology, visit https://www.coolitsystems.com/ and follow @CoolIT Systems on LinkedIn.